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 STGE50NC60WD
N-channel 50A - 600V - ISOTOP Ultra fast switching PowerMESHTM IGBT
Features
Type STGE50NC60WD

VCES 600V
VCE(sat) (Max) IC @25C @100C 2.5V 50A
High current capability High frequency operation Low CRES/CIES ratio (no cross-conduction susceptibility Very soft ultra fast recovery antiparallel diode ISOTOP
Description
Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the PowerMESHTM IGBTs, with outstanding performances. The suffix "W" identifies a family optimized for very high frequency applications. Figure 1. Internal schematic diagram
Applications

Very high frequency inverters HF, SMPS and PFC in both hard switching and resonant topologies UPS Motor drivers Welding
Table 1.
Device summary
Order code Marking GE50NC60WD Package ISOTOP Packaging Tube
STGE50NC60WD
July 2007
Rev 2
1/14
www.st.com 14
Contents
STGE50NC60WD
Contents
1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) ............................ 7
3 4 5
Test circuit
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
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STGE50NC60WD
Electrical ratings
1
Table 2.
Symbol VCES IC (1) IC (1) ICL (2) VGE IF PTOT Tstg Tj
Electrical ratings
Absolute maximum ratings
Parameter Collector-emitter voltagesGS = 0) Collector current (continuous) at TC = 25C Collector current (continuous) at TC = 100C Collector current (pulsed) Gate-emitter voltage Diode RMS forward current at Tc=25C Total dissipation at TC = 25C Storage temperature -55 to 150 Operating junction temperature
T -T JMAX C I ( T ) = ----------------------------------------------------------------------------------------------------CC R xV (T , I ) THJ - C CESAT ( MAX ) C C
Value 600 100 50 250 20 30 260
Unit V A A A V A W C
1. Calculated according to the iterative formula:
2. Pulse width limited by Tjmax
Table 3.
Symbol Rthj-case Rthj-case Rthj-amb
Thermal resistance
Parameter Thermal resistance junction-case (IGBT) Thermal resistance junction-case (diode) Thermal resistance junction-amb Min ---Typ ---Max 0.48 1.5 50 Unit C/W C/W C/W
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Electrical characteristics
STGE50NC60WD
2
Electrical characteristics
(TJ = 25 C unless otherwise specified) Table 4.
Symbol VBR(CES) VCE(sat) VGE(th) ICES IGES gfs
Static
Parameter Collector-emitter breakdown voltage Test conditions IC= 1mA, VGE= 0 Min. 600 2.1 1.9 3.75 2.6 Typ. Max. Unit V V V V A mA nA S
Collector-emitter saturation VGE= 15V, IC= 40A voltage VGE= 15V, IC=40A,Tc=125C Gate threshold voltage Collector cut-off current (VGE = 0) Gate-emitter leakage current (VCE = 0) Forward transconductance VCE= VGE, IC= 250 A VCE= Max rating,TC= 25C VCE= Max rating,TC= 125C VGE= 20V, VCE= 0 VCE = 15V, IC= 40A
5.75 500 5 100 25
Table 5.
Symbol Cies Coes Cres Qg Qge Qgc
Dynamic
Parameter Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-emitter charge Gate-collector charge Test conditions VCE = 25V, f = 1MHz, VGE = 0 VCE = 390V, IC = 40A, VGE = 15V, Figure 17 Min. Typ. 4700 410 90 195 32 82 Max. Unit pF pF pF nC nC nC
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STGE50NC60WD
Electrical characteristics
Table 6.
Symbol td(on) tr (di/dt)on td(on) tr (di/dt)on tr(Voff) td(Voff) tf tr(Voff) td(Voff) tf
Switching on/off (inductive load)
Parameter Turn-on delay time Current rise time Turn-on current slope Turn-on delay time Current rise time Turn-on current slope Off voltage rise time Turn-off delay time Current fall time Off voltage rise time Turn-off delay time Current fall time Test conditions VCC = 390V, IC = 40A , RG= 3.3 VGE= 15V, Figure 16, Figure 18 VCC = 390V, IC = 40A , RG= 3.3 VGE= 15V, Tj = 125C Figure 16, Figure 18 VCC = 390V, IC = 40A RG= 3.3 VGE= 15V, , Figure 16, Figure 18 VCC = 390V, IC = 40A , RG= 3.3 VGE= 15V, Tj = 125C Figure 16, Figure 18 Min. Typ. 52 17 2400 50 19 2020 31 240 35 59 280 63 Max. Unit ns ns A/s ns ns A/s ns ns ns ns ns ns
Table 7.
Symbol Eon(1) Eoff(2) Ets Eon(1) Eoff(2) Ets
Switching energy (inductive load)
Parameter Turn-on switching losses Turn-off switching losses Total switching losses Turn-on switching losses Turn-off switching losses Total switching losses Test conditions VCC = 390V, IC = 40A , RG= 3.3 VGE= 15V, Figure 18 VCC = 390V, IC = 40A RG= 3.3 VGE= 15V, , Tj = 125C Figure 18 Min. Typ. 365 560 925 635 910 1545 Max. 470 790 1260 Unit J J J J J J
1. Eon is the tun-on losses when a typical diode is used in the test circuit in Figure 18 If the IGBT is offered in a package with a co-pak diode, the co-pack diode is used as external diode. IGBTs & Diode are at the same temperature (25C and 125C) 2. Turn-off losses include also the tail of the collector current
5/14
Electrical characteristics
STGE50NC60WD
Table 8.
Symbol
Collector-emitter diode
Parameter Test conditions If = 15A Min. Typ. 1.5 1.2 1.35 55 100 3.6 164 525 6.4 Max. 2.9 Unit V V V ns nC A ns nC A
Vf
Forward on-voltage
If = 15A, Tj = 125C If = 40A, Tj = 125C
trr Qrr Irrm trr Qrr Irrm
Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current
If = 40A,VR = 50V, Tj = 25C, di/dt = 100 A/s Figure 19 If = 40A,VR = 50V, Tj =125C, di/dt = 100A/s Figure 19
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STGE50NC60WD
Electrical characteristics
2.1
Figure 2.
Electrical characteristics (curves)
Output characteristics Figure 3. Transfer characteristics
Figure 4.
Transconductance
Figure 5.
Collector-emitter on voltage vs temperature
Figure 6.
Gate charge vs gate-source voltage Figure 7.
Capacitance variations
7/14
Electrical characteristics Figure 8. Normalized gate threshold voltage vs temperature Figure 9.
STGE50NC60WD Collector-emitter on voltage vs collector current
Figure 10. Normalized breakdown voltage vs temperature
Figure 11. Switching losses vs temperature
Figure 12. Switching losses vs gate resistance Figure 13. Switching losses vs collector current
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STGE50NC60WD Figure 14. Turn-off SOA
Electrical characteristics Figure 15. Emitter-collector diode characteristics
9/14
Test circuit
STGE50NC60WD
3
Test circuit
Figure 17. Gate charge test circuit
Figure 16. Test circuit for inductive load switching
Figure 18. Switching waveform
Figure 19. Diode recovery time waveform
10/14
STGE50NC60WD
Package mechanical data
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
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Package mechanical data
STGE50NC60WD
ISOTOP MECHANICAL DATA
DIM. MIN. A B C D E F G H J K L M N O 11.8 8.9 1.95 0.75 12.6 25.15 31.5 4 4.1 14.9 30.1 37.8 4 7.8 8.2 4.3 15.1 30.3 38.2 mm TYP. MAX. 12.2 9.1 2.05 0.85 12.8 25.5 31.7 MIN. 0.466 0.350 0.076 0.029 0.496 0.990 1.240 0.157 0.161 0.586 1.185 1.488 0.157 0.307 0.322 0.169 0.594 1.193 1.503 inch TYP. MAX. 0.480 0.358 0.080 0.033 0.503 1.003 1.248
G O B
A
N
D E F
J K L M
H
C
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STGE50NC60WD
Revision History
5
Table 9.
Date
Revision History
Revision history
Revision 1 2 First release New Figure 1: Internal schematic diagram Changes
07-May-2006 24-Jul-2007
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STGE50NC60WD
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
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